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U.S. Department of Energy
Office of Scientific and Technical Information

Development of metallization process: FSA Project, cell, and module-formation research area. Quarterly technical progress report No. 6329-15 for the period ending June 30, 1983

Technical Report ·
OSTI ID:5695680
A non-lead frit paste was received from Thick Film Systems Inc. and evaluated. The results were not promising. Additional work was done on a two-step process where the bulk of the metallization is Mo/Sn but a small ohmic pad is silver. This approach was successful. A new matrix of paste formulations was developed with JPL and Electrink, Inc. personnel. A series of 12 pastes was ordered from Electrink, Inc.
Research Organization:
Spectrolab, Inc., Sylmar, CA (USA)
DOE Contract Number:
NAS-7-100-956205
OSTI ID:
5695680
Report Number(s):
DOE/JPL/956205-83/5; ON: DE84000253
Country of Publication:
United States
Language:
English