Process for electrically interconnecting electrodes

Patent · Mon Dec 31 23:00:00 EST 2001

OSTI ID:874502

Carey, Paul G ^[1]; Thompson, Jesse B ^[2]; Colella, Nicolas J ^[3]; Williams, Kenneth A ^[3]

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1. Mountain View, CA
2. Brentwood, CA
3. Livermore, CA

Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb--Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb--Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA
• DOE Contract Number: W-7405-ENG-48
• Assignee: The Regents of the University of California (Oakland, CA)
• Patent Number(s): US 6402881
• OSTI ID: 874502
• Country of Publication: United States
• Language: English

Related Subjects

/156/174/528/
&lt;6
active
active surface
breakage
cells
components
conductive
contact
conventional
copper
cream
current
degradation
developed
electrical
electrical interconnect
electrically
electrodes
electronic
electronic components
eliminated
eliminates
employs
fluxless
interconnect
interconnecting
interconnects
lead-tin
mil
no-clean
paste
pb--sn
process
providing
residue
resistance
secured
shown
silver-silicone
solar
solar cell
solder
strips
surfaces
temperature
testing
thick
undesired
value