Solar cell array interconnects

Patent · Sun Jan 01 00:00:00 EST 1995

OSTI ID:870154

Carey, Paul G ^[1]; Thompson, Jesse B ^[2]; Colella, Nicolas J ^[3]; Williams, Kenneth A ^[3]

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1. Mountain View, CA
2. Brentwood, CA
3. Livermore, CA

Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: Regents of University of California (Oakland, CA)
• Patent Number(s): US 5466302
• OSTI ID: 870154
• Country of Publication: United States
• Language: English

Related Subjects

solar
cell
array
interconnects
electrical
cells
electronic
components
silver-silicone
paste
lead-tin
pb-sn
no-clean
fluxless
solder
cream
whereby
breakage
mil
thick
conventional
interconnect
eliminated
employs
copper
strips
secured
conductive
temperature
eliminates
undesired
residue
active
surfaces
testing
shown
degradation
developed
current
providing
contact
resistance
value
solar cell
solar cells
active surface
contact resistance
electronic components
cell array
mil thick
resistance value
electrical interconnects
active surfaces
electrical interconnect
conductive paste
current testing
/136/228/438/