Modular package for cooling a laser diode array

Patent · Tue Dec 31 23:00:00 EST 1991

OSTI ID:868245

Mundinger, David C ^[1]; Benett, William J ^[2]; Beach, Raymond J ^[2]

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1. Stockton, CA
2. Livermore, CA

A laser diode array is disclosed that includes a plurality of planar packages and active cooling. The laser diode array may be operated in a long duty cycle, or in continuous operation. A laser diode bar and a microchannel heat sink are thermally coupled in a compact, thin planar package having the laser diode bar located proximate to one edge. In an array, a number of such thin planar packages are secured together in a stacked configuration, in close proximity so that the laser diodes are spaced closely. The cooling means includes a microchannel heat sink that is attached proximate to the laser bar so that it absorbs heat generated by laser operation. To provide the coolant to the microchannels, each thin planar package comprises a thin inlet manifold and a thin outlet manifold connected to an inlet corridor and an outlet corridor. The inlet corridor comprises a hole extending through each of the packages in the array, and the outlet corridor comprises a hole extending through each of the packages in the array. The inlet and outlet corridors are connected to a conventional coolant circulation system. The laser diode array with active cooling has application as an optical pump for high power solid state lasers. Further, it can be incorporated in equipment such as communications devices and active sensors, and in military and space applications, and it can be useful in applications having space constraints and energy limitations.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA
• DOE Contract Number: W-7405-ENG-48
• Assignee: United States of America as represented by Department of Energy (Washington, DC)
• Patent Number(s): US 5105429
• OSTI ID: 868245
• Country of Publication: United States
• Language: English

Related Subjects

/372/257/
absorbs
absorbs heat
active
active cooling
active sensors
application
applications
array
attached
bar
channel heat
circulation
close
close proximity
closely
communications
compact
comprises
configuration
connected
constraints
continuous
continuous operation
conventional
coolant
coolant circulation
cooling
cooling means
corridor
corridors
coupled
cycle
devices
diode
diode array
diode bar
diodes
disclosed
duty
duty cycle
edge
energy
equipment
extending
generated
heat
heat generated
heat sink
incorporated
inlet
inlet manifold
laser
laser bar
laser diode
laser diodes
laser operation
lasers
limitations
located
located proximate
manifold
means
microchannel
microchannel heat
microchannels
military
modular
operated
operation
optical
optical pump
outlet
outlet manifold
package
package comprises
packages
planar
planar package
plurality
power
power solid
provide
proximate
proximity
pump
secured
sensors
sink
solid
space
space applications
space constraints
spaced
spaced close
spaced closely
stacked
stacked configuration
thermally
thermally coupled
useful