Thin planar package for cooling an array of edge-emitting laser diodes
This patent describes an apparatus for actively cooling a diode with a coolant pumped by a circulation system. It comprises a planar assembly thermally and electrically connected to the diode, the planar assembly comprising; a plurality of microchannels actively cooled by the coolant, the microchannels being thermally connected to the diode so that heat is conducted between the diode and the microchannels, inlet corridors for providing coolant to the assembly, outlet corridors for removing coolant from the assembly, inlet passageways integral to the assembly, each of the inlet passageways positioned to provide coolant flow between one of the inlet corridors and one or more microchannels, and outlet passageways integral to the assembly, each of the outlet passageways positioned to provide coolant flow between one of the outlet corridors and one or more electrical microchannels.
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- Patent Number(s):
- US 5105430; A
- Application Number:
- PPN: US 7-682770
- OSTI ID:
- 5021662
- Resource Relation:
- Patent File Date: 9 Apr 1991
- Country of Publication:
- United States
- Language:
- English
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Modular package for cooling a laser diode array
Modular package for cooling a laser diode array