Modular package for cooling a laser diode array
This patent describes an apparatus for actively cooling a diode with coolant pumped by a circulation system. It comprises a thin planar assembly thermally and electrically connected to a diode, an inlet corridor providing coolant to the assembly, an inlet manifold integral in the assembly, the inlet manifold providing coolant flow between the inlet corridor and the microchannels in the heat sink region, an outlet corridor removing coolant from the assembly, and an outlet manifold integral in the assembly, the outlet manifold providing coolant flow between the microchannels in the heat sink region and the outlet corridor, wherein the planar assembly further comprises a top layer, a middle layer, and a bottom layer bonded together; the top layer and the middle layer defining the microchannels in the heat sink region and the outlet manifold; the bottom layer and the middle layer defining the inlet manifold; and the middle layer comprising a slot between the inlet manifold and the microchannels in the heat sink region.
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- Patent Number(s):
- US 5105429; A
- Application Number:
- PPN: US 7-549509
- OSTI ID:
- 5021687
- Resource Relation:
- Patent File Date: 6 Jul 1990
- Country of Publication:
- United States
- Language:
- English
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