Modular package for cooling a laser diode array

Patent · Wed Jan 01 00:00:00 EST 1992

OSTI ID:868245

Mundinger, David C ^[1]; Benett, William J ^[2]; Beach, Raymond J ^[2]

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1. Stockton, CA
2. Livermore, CA

A laser diode array is disclosed that includes a plurality of planar packages and active cooling. The laser diode array may be operated in a long duty cycle, or in continuous operation. A laser diode bar and a microchannel heat sink are thermally coupled in a compact, thin planar package having the laser diode bar located proximate to one edge. In an array, a number of such thin planar packages are secured together in a stacked configuration, in close proximity so that the laser diodes are spaced closely. The cooling means includes a microchannel heat sink that is attached proximate to the laser bar so that it absorbs heat generated by laser operation. To provide the coolant to the microchannels, each thin planar package comprises a thin inlet manifold and a thin outlet manifold connected to an inlet corridor and an outlet corridor. The inlet corridor comprises a hole extending through each of the packages in the array, and the outlet corridor comprises a hole extending through each of the packages in the array. The inlet and outlet corridors are connected to a conventional coolant circulation system. The laser diode array with active cooling has application as an optical pump for high power solid state lasers. Further, it can be incorporated in equipment such as communications devices and active sensors, and in military and space applications, and it can be useful in applications having space constraints and energy limitations.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: United States of America as represented by Department of Energy (Washington, DC)
• Patent Number(s): US 5105429
• OSTI ID: 868245
• Country of Publication: United States
• Language: English

Related Subjects

modular
package
cooling
laser
diode
array
disclosed
plurality
planar
packages
active
operated
duty
cycle
continuous
operation
bar
microchannel
heat
sink
thermally
coupled
compact
located
proximate
edge
secured
stacked
configuration
close
proximity
diodes
spaced
closely
means
attached
absorbs
generated
provide
coolant
microchannels
comprises
inlet
manifold
outlet
connected
corridor
extending
corridors
conventional
circulation
application
optical
pump
power
solid
lasers
incorporated
equipment
communications
devices
sensors
military
space
applications
useful
constraints
energy
limitations
stacked configuration
space applications
active cooling
outlet manifold
absorbs heat
power solid
diode bar
optical pump
laser bar
laser operation
inlet manifold
laser diodes
cooling means
continuous operation
close proximity
heat sink
laser diode
diode array
duty cycle
heat generated
thermally coupled
microchannel heat
space constraints
planar package
package comprises
spaced close
spaced closely
active sensors
located proximate
channel heat
coolant circulation
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