Soft x-ray reduction camera for submicron lithography
Patent
·
OSTI ID:867756
- 2708 Rembrandt Pl., Modesto, CA 95356
- 7911 Mines Rd., Livermore, CA 94550
Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm.sup.2. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Hawryluk, Andrew M. (2708 Rembrandt Pl., Modesto, CA 95356);Seppala, Lynn G. (7911 Mines Rd., Livermore, CA 94550)
- Patent Number(s):
- US 5003567
- OSTI ID:
- 867756
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
/378/
135
5x
camera
capable
characteristics
cm
coated
coated wafer
components
demagnified
depth
design
diffraction
diffraction limited
distortion
distortion free
fabricated
field
figures
form
free
image
imaging
imaging lens
imaging lenses
larger
laser
laser produced
lenses
limited
lithography
mask
masks
microns
mirrors
multilayer
multilayer mirror
nm
nm radiation
optic
optical
optical component
optical components
patterned
performed
plasma
produced
produced plasma
projecting
projection
projection lithography
radiation
reduction
reduction camera
reflecting
relatively
resist
resist coated
resolution
soft
soft x-ray
source
spherical
submicron
substrates
thick
varying
view
wafer
x-ray
x-ray multilayer
x-ray optical
x-ray projection
x-ray reduction
135
5x
camera
capable
characteristics
cm
coated
coated wafer
components
demagnified
depth
design
diffraction
diffraction limited
distortion
distortion free
fabricated
field
figures
form
free
image
imaging
imaging lens
imaging lenses
larger
laser
laser produced
lenses
limited
lithography
mask
masks
microns
mirrors
multilayer
multilayer mirror
nm
nm radiation
optic
optical
optical component
optical components
patterned
performed
plasma
produced
produced plasma
projecting
projection
projection lithography
radiation
reduction
reduction camera
reflecting
relatively
resist
resist coated
resolution
soft
soft x-ray
source
spherical
submicron
substrates
thick
varying
view
wafer
x-ray
x-ray multilayer
x-ray optical
x-ray projection
x-ray reduction