Soft x-ray reduction camera for submicron lithography

Patent · Tue Mar 26 04:00:00 EST 1991

OSTI ID:7083865

Hawryluk, A M; Seppala, L G

Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm[sup 2]. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics. 9 figures.

• DOE Contract Number: W-7405-ENG-48
• Assignee: PTO; EDB-94-111354
• Patent Number(s): US 5003567; A
• Application Number: PPN: US 7-308332
• OSTI ID: 7083865
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
DESIGN
ELECTROMAGNETIC RADIATION
ELECTRONIC CIRCUITS
INTEGRATED CIRCUITS
IONIZING RADIATIONS
MASKING
MICROELECTRONIC CIRCUITS
OPTICAL SYSTEMS
RADIATIONS
SOFT X RADIATION
X RADIATION