Soft x-ray reduction camera for submicron lithography
Soft x-ray projection lithography can be performed using x-ray optical components and spherical imaging lenses (mirrors), which form an x-ray reduction camera. The x-ray reduction is capable of projecting a 5x demagnified image of a mask onto a resist coated wafer using 4.5 nm radiation. The diffraction limited resolution of this design is about 135 nm with a depth of field of about 2.8 microns and a field of view of 0.2 cm[sup 2]. X-ray reflecting masks (patterned x-ray multilayer mirrors) which are fabricated on thick substrates and can be made relatively distortion free are used, with a laser produced plasma for the source. Higher resolution and/or larger areas are possible by varying the optic figures of the components and source characteristics. 9 figures.
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- PTO; EDB-94-111354
- Patent Number(s):
- US 5003567; A
- Application Number:
- PPN: US 7-308332
- OSTI ID:
- 7083865
- Resource Relation:
- Patent File Date: 9 Feb 1989
- Country of Publication:
- United States
- Language:
- English
Similar Records
Soft x-ray reduction camera for submicron lithography
Soft x-ray projection lithography using an x-ray reduction camera