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U.S. Department of Energy
Office of Scientific and Technical Information

Method of deposition of silicon carbide layers on substrates and product

Patent ·
OSTI ID:865089

A method for direct chemical vapor deposition of silicon carbide to substrates, especially nuclear waste particles, is provided by the thermal decomposition of methylsilane at about 800.degree. C. to 1050.degree. C. when the substrates have been confined within a suitable coating environment.

Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN
DOE Contract Number:
W-7405-ENG-26
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Number(s):
US 4459338
OSTI ID:
865089
Country of Publication:
United States
Language:
English