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U.S. Department of Energy
Office of Scientific and Technical Information

Method of deposition of silicon carbide layers on substrates and product

Patent ·
OSTI ID:6158252

A method for direct chemical vapor deposition of silicon carbide to substrates, especially nuclear waste particles, is provided by the thermal decomposition of methylsilane at about 800/sup 0/ to 1050/sup 0/ C when the substrates have been confined within a suitable coating environment.

Assignee:
Dept. of Energy
Patent Number(s):
US 4459338
OSTI ID:
6158252
Country of Publication:
United States
Language:
English