skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Deposition method for producing silicon carbide high-temperature semiconductors

Patent ·
OSTI ID:6423339

A deposition method is described for producing silicon carbide high-temperature semiconductors. The method comprises placing at least one semiconductor substrate composed of silicon carbide in a fluidized bed silicon carbide deposition reactor comprising bed particles. The fluidized bed comprises SiC, Si particles or mixtures thereof; introducing reactants selected from CH/sub 3/SiCl/sub 3/ or a SiH/sub 4/ /C/sub 3/H/sub 8/ mixture into the reactor; fluidizing by hydrogen gas in a mildly bubbling mode through a gas distributor at the bottom of the reactor; and heating the substrate at temperatures around 1200/sup 0/-1500/sup 0/C thereby causing deposition of a layer of silicon carbide on the semiconductor substrate. A deposition method wherein at least one substrate is heated at a deposition temperature, while the bed particles are unheated is also given.

Assignee:
Dept. of Energy, Washington, DC
Patent Number(s):
US 4664944
OSTI ID:
6423339
Resource Relation:
Patent File Date: Filed date 31 Jan 1986
Country of Publication:
United States
Language:
English