The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au
Journal Article
·
· Journal of Electronic Materials
No abstract prepared.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Director, Office of Science. Office of Basic Energy Sciences. Division of Materials Sciences (US)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 821434
- Report Number(s):
- LBNL-47674; JECMA5; R&D Project: 403101; TRN: US200411%%151
- Journal Information:
- Journal of Electronic Materials, Vol. 30, Issue 9; Other Information: Journal Publication Date: 09/2001; PBD: 1 May 2001; ISSN 0361-5235
- Country of Publication:
- United States
- Language:
- English
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