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The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

Journal Article · Tue May 01 00:00:00 EDT 2001 · Journal of Electronic Materials

DOI:https://doi.org/10.1007/s11664-001-0133-9· OSTI ID:821434

Song, H G ^[1]; Ahn, J P; Morris, Jr, J W

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Research Organization:: Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (US)

Sponsoring Organization:: USDOE Director, Office of Science. Office of Basic Energy Sciences. Division of Materials Sciences (US)

DOE Contract Number:: AC03-76SF00098

OSTI ID:: 821434

Report Number(s):: LBNL--47674

Journal Information:: Journal of Electronic Materials, Journal Name: Journal of Electronic Materials Journal Issue: 9 Vol. 30; ISSN JECMA5; ISSN 0361-5235

Country of Publication:: United States

Language:: English

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Related Subjects

36 MATERIALS SCIENCE
EUTECTICS
LAWRENCE BERKELEY LABORATORY
MICROSTRUCTURE