Microstructural evolution of eutectic Au-Sn solder joints
- Univ. of California, Berkeley, CA (United States)
Current trends toward miniaturization and the use of lead(Pb)-free solder in electronic packaging present new problems in the reliability of solder joints. This study was performed in order to understand the microstructure and microstructural evolution of small volumes of nominally eutectic Au-Sn solder joints (80Au-20Sn by weight), which gives insight into properties and reliability.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC), Basic Energy Sciences (BES)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 797857
- Report Number(s):
- LBNL-50573; R&D Project: 511203; B& R KC0201030; TRN: US200216%%161
- Resource Relation:
- Other Information: TH: Thesis (Ph.D.); Submitted to the University of California, Berkeley, CA (US); PBD: 31 May 2002
- Country of Publication:
- United States
- Language:
- English
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