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The microstructure of ultrafine eutectic Au-Sn solder joints on Cu

Journal Article · Thu Jan 27 23:00:00 EST 2000 · Journal of Electronic Materials

DOI:https://doi.org/10.1007/s11664-000-0170-9· OSTI ID:765470

Song, Ho Geon ^[1]; Morris, Jr, J W; McCormack, M T

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No abstract prepared.

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Research Organization:: Lawrence Berkeley National Lab., CA (US)

Sponsoring Organization:: USDOE Director, Office of Science. Office of Basic Energy Studies. Division of Materials Sciences (US)

DOE Contract Number:: AC03-76SF00098

OSTI ID:: 765470

Report Number(s):: LBNL--45030

Journal Information:: Journal of Electronic Materials, Journal Name: Journal of Electronic Materials Journal Issue: 8 Vol. 29; ISSN JECMA5; ISSN 0361-5235

Country of Publication:: United States

Language:: English

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Related Subjects

36 MATERIALS SCIENCE
COPPER
EUTECTICS
GOLD ALLOYS
MICROSTRUCTURE
SOLDERED JOINTS
TIN ALLOYS