The microstructure of ultrafine eutectic Au-Sn solder joints on Cu
Journal Article
·
· Journal of Electronic Materials
No abstract prepared.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Director, Office of Science. Office of Basic Energy Studies. Division of Materials Sciences (US)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 765470
- Report Number(s):
- LBNL-45030; JECMA5; R&D Project: 511203; TRN: AH200035%%109
- Journal Information:
- Journal of Electronic Materials, Vol. 29, Issue 8; Other Information: PBD: 28 Jan 2000; ISSN 0361-5235
- Country of Publication:
- United States
- Language:
- English
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