Au-Ni-Sn intermetallic phase relationships in eutectic Pb-Sn solder formed on Ni/Au metallization

Title: Au-Ni-Sn intermetallic phase relationships in eutectic Pb-Sn solder formed on Ni/Au metallization

Journal Article · Sun Oct 01 00:00:00 EDT 2000 · Journal of Electronic Materials

OSTI ID:782493

Song, H G; Ahn, J P; Minor, A M; Morris, Jr, J W

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Research Organization:: Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

Sponsoring Organization:: USDOE Director, Office of Science. Office of Basic Energy Studies. Division of Materials Sciences (US)

Report Number(s):: LBNL-46739; JECMA5; R&D Project: 511201; TRN: US200201%%586

Journal Information:: Journal of Electronic Materials, Vol. 30, Issue 4; Other Information: Journal Publication Date: Apr. 2001; PBD: 1 Oct 2000; ISSN 0361-5235

Inhibiting growth of the Au{sub 0.5}Ni{sub 0.5}Sn{sub 4} Intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization

Journal Article · Wed Mar 01 00:00:00 EST 2000 · Journal of Electronic Materials · OSTI ID:782493

Minor, A M; Morris, Jr, J W

Journal Article · Tue May 01 00:00:00 EDT 2001 · Journal of Electronic Materials · OSTI ID:782493

Song, H G; Ahn, J P; Morris, Jr, J W

Journal Article · Fri Jan 28 00:00:00 EST 2000 · Journal of Electronic Materials · OSTI ID:782493

Song, Ho Geon; Morris, Jr, J W; McCormack, M T

36 MATERIALS SCIENCE
EUTECTICS
LEAD ALLOYS
TIN ALLOYS
SOLDERING
METALLURGICAL FLUX
NICKEL ALLOYS
GOLD ALLOYS
INTERMETALLIC COMPOUNDS
PHASE STUDIES