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In situ X-ray microscopic observation of the electromigration in passivated Cu interconnects

Journal Article · Wed Jan 31 23:00:00 EST 2001 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.1356446· OSTI ID:779764

Schneider, G ^[1]; Hambach, D; Niemann, B; Kaulich, B; Susini, J; Hoffmann, N; Hasse, W

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Research Organization:: Lawrence Berkeley National Lab., CA (US)

Sponsoring Organization:: USDOE Director, Office of Science. Office of Basic Energy Studies (US)

DOE Contract Number:: AC03-76SF00098

OSTI ID:: 779764

Report Number(s):: LBNL--47468

Journal Information:: Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 13 Vol. 78; ISSN APPLAB; ISSN 0003-6951

Country of Publication:: United States

Language:: English

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Related Subjects

36 MATERIALS SCIENCE
COPPER
ELECTROPHORESIS
MICROSCOPY
PASSIVATION
X RADIATION