Thermal cycle tests on double sided and multilayer printed wiring boards
Substantial differences were found in the capability of plated-through holes in both double sided and multilayer printed wiring boards to withstand thermal cycling between -65/sup 0/ and 125/sup 0/C. The circuit pattern used for the test contained 240 holes connected in series, 80 each of 0.51 mm, 0.76 mm and 1.02 mm dia. Double sided glass-epoxy and glass-polyimide boards withstood 544 cycles with a total circuit resistance increase of 2 percent. However, paper-epoxy boards revealed many open circuits and substantial electrical resistance increases for the same number of cycles. Considerable variation in electrical resistance increases in glass-epoxy multilayer boards was detected. Analysis of the behavior of the multilayer boards was clouded by the poor quality of the plated-through holes used. Current carrying capability provided a useful indication of hole degradation after cycling. A critical factor effecting plated-through hole reliability in thermal cycling environment appears to be laminate composition. Further testing is suggested to determine the necessity for additional property requirements for laminate procurement specifications, such as minimum glass transition temperature and/or designation of resin composition. Glass-polyimide laminates should be considered for multilayer boards which must withstand extreme thermal cycling environments.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- DOE Contract Number:
- AT(29-1)-789
- OSTI ID:
- 7363348
- Report Number(s):
- SAND-76-0107
- Country of Publication:
- United States
- Language:
- English
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