Polyimide/glass multilayer printed wiring boards. Final report

Technical Report · Sun Jul 01 00:00:00 EDT 1984

OSTI ID:6736218

Lula, J W

Multilayer printed wiring boards (PWBs) were manufactured from a polyimide/glass reinforced copper-clad laminate and prepreg. A lamination cycle and innerlayer copper surface treatment were developed that gave satisfactory delamination resistance at soldering temperatures. When compared to similar epoxy/glass multilayer PWBs, the polyimide PWBs had higher thermal stability, greater resistance to raised lands, fewer plating voids, less outgassing, and adhesion that was equivalent to urethane foam encapsulants.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 6736218
• Report Number(s): BDX-613-3084; ON: DE84015092
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ADHESION
COLLOIDS
DEGASSING
DISPERSIONS
ELECTRONIC CIRCUITS
FABRICATION
FOAMS
GLASS
IMIDES
JOINING
MANUFACTURING
MATERIALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTIC FOAMS
PLASTICS
POLYAMIDES
POLYMERS
POLYURETHANES
POTTING
PRINTED CIRCUITS
SOLDERING
SYNTHETIC MATERIALS
WELDING