Improving delamination resistance of multilayer printed wiring boards
Bendix has incorporated black oxide innerlayer surface treatment and dry nitrogen prepreg conditioning into the manufacturing process for multilayer PWBs. Before these changes, interlaminar adhesion was marginal and delaminations regularly occurred during solder dipping and leveling. Since the implementation of these changes, Bendix has not experienced any delaminated multilayer PWBs, and they may be immersed in molten solder for 2 minutes or more without visual damage. Both black oxide and red oxide innerlayer surface treatments have shown the capability to provide acceptable delamination resistance for multilayer PWBs made from FR-4 material. Optimum processing parameters for applying the oxide treatment have been determined. In order to manufacture a multilayer PWB that will withstand solder dipping/leveling as well as subsequent drag soldering, its is necessary to remove absorbed moisture from the prepreg before lamination. Data have been gathered on the rate of moisutre removal from prepreg when dried and on the rate of moisture reabsorption when dried prepreg is exposed to 24/sup 0/C/50% RH environment.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 5583045
- Report Number(s):
- BDX-613-2413
- Country of Publication:
- United States
- Language:
- English
Similar Records
Cure cycle evaluation for multilayer printed wiring boards
Multilayer printed wiring board lamination
Related Subjects
360104* -- Metals & Alloys-- Physical Properties
440300 -- Miscellaneous Instruments-- (-1989)
47 OTHER INSTRUMENTATION
CHALCOGENIDES
CLEANING
COPPER
COPPER COMPOUNDS
COPPER OXIDES
ELECTRONIC CIRCUITS
ELEMENTS
FABRICATION
INTERFACES
JOINING
METALS
OXIDES
OXYGEN COMPOUNDS
PRINTED CIRCUITS
SOLDERING
SURFACE CLEANING
SURFACE FINISHING
SURFACE TREATMENTS
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS
WELDING