Double-sided polyimide printed wiring boards. Final report

Technical Report · Thu Apr 01 00:00:00 EST 1982

OSTI ID:5395607

Lula, J W

Double-sided polyimide/glass printed wiring boards (PWBs) were evaluated for high temperature performance and compared to epoxy/glass PWBs (type GH). Test specimens, as well as sample PWBs, were manufactured from both materials and tested for thermal stability, moisture absorption, copper peel strength, and resistance to soldering damage. Although the polyimide laminate absorbed more than twice the amount of moisture as the epoxy laminate, the polyimide laminate had greater thermal stability, retained greater peel strength at elevated temperatures, and showed comparatively little damage during soldering processes.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5395607
• Report Number(s): BDX-613-2761; ON: DE82012051
• Country of Publication: United States
• Language: English

Related Subjects

47 OTHER INSTRUMENTATION
36 MATERIALS SCIENCE
GLASS
MECHANICAL PROPERTIES
POLYMERS
PRINTED CIRCUITS
PERFORMANCE
ELECTRONIC CIRCUITS
440300* - Miscellaneous Instruments- (-1989)
360600 - Other Materials