Vacuum multilayer lamination of printed wiring boards
This experiment investigates vacuum multilayer lamination of rigid/flex, epoxy glass, polyimide glass, and polyimide quartz printed wiring boards. The effectiveness of the vacuum in removing entrapped air during the lamination cycle is demonstrated. The results of the experiment have also shown that vacuum lamination of epoxy glass multilayers improves the delamination resistance. Thus, epoxy glass multilayers that have been vacuum laminated will be able to withstand soldering temperatures longer without delaminating. Also, the experiment shows that vacuum multilayer lamination does not significantly change thickness, layer-to-layer registration, glass transition temperature, dielectric spacing between conductors, electrical resistance following thermal shock test, and other critical printed wiring board properties.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
- Sponsoring Organization:
- DOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 7138288
- Report Number(s):
- KCP-613-4865; ON: DE93004912
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
360606 -- Other Materials-- Physical Properties-- (1992-)
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ADHESION
DIMENSIONS
ELECTRONIC CIRCUITS
EPOXIDES
FABRICATION
GLASS
IMIDES
LAYERS
MATERIALS TESTING
MATERIALS WORKING
MINERALS
NONDESTRUCTIVE TESTING
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
OXIDE MINERALS
PRESSING
PRINTED CIRCUITS
QUARTZ
TESTING
THERMAL TESTING
THICKNESS
VOIDS