Vacuum multilayer lamination of printed wiring boards

Technical Report · Sun Nov 01 00:00:00 EST 1992

OSTI ID:7138288

Wilkus, J W

This experiment investigates vacuum multilayer lamination of rigid/flex, epoxy glass, polyimide glass, and polyimide quartz printed wiring boards. The effectiveness of the vacuum in removing entrapped air during the lamination cycle is demonstrated. The results of the experiment have also shown that vacuum lamination of epoxy glass multilayers improves the delamination resistance. Thus, epoxy glass multilayers that have been vacuum laminated will be able to withstand soldering temperatures longer without delaminating. Also, the experiment shows that vacuum multilayer lamination does not significantly change thickness, layer-to-layer registration, glass transition temperature, dielectric spacing between conductors, electrical resistance following thermal shock test, and other critical printed wiring board properties.

• Research Organization: Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
• Sponsoring Organization: USDOE; USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 7138288
• Report Number(s): KCP-613-4865; ON: DE93004912
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
36 MATERIALS SCIENCE
PRINTED CIRCUITS
PRESSING
ADHESION
EPOXIDES
GLASS
IMIDES
LAYERS
QUARTZ
THERMAL TESTING
THICKNESS
VOIDS
DIMENSIONS
ELECTRONIC CIRCUITS
FABRICATION
MATERIALS TESTING
MATERIALS WORKING
MINERALS
NONDESTRUCTIVE TESTING
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
OXIDE MINERALS
TESTING
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
360606 - Other Materials- Physical Properties- (1992-)