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Title: Thermal cycle tests on double sided and multilayer printed wiring boards

Abstract

Substantial differences were found in the capability of plated-through holes in both double sided and multilayer printed wiring boards to withstand thermal cycling between -65/sup 0/ and 125/sup 0/C. The circuit pattern used for the test contained 240 holes connected in series, 80 each of 0.51 mm, 0.76 mm and 1.02 mm dia. Double sided glass-epoxy and glass-polyimide boards withstood 544 cycles with a total circuit resistance increase of 2 percent. However, paper-epoxy boards revealed many open circuits and substantial electrical resistance increases for the same number of cycles. Considerable variation in electrical resistance increases in glass-epoxy multilayer boards was detected. Analysis of the behavior of the multilayer boards was clouded by the poor quality of the plated-through holes used. Current carrying capability provided a useful indication of hole degradation after cycling. A critical factor effecting plated-through hole reliability in thermal cycling environment appears to be laminate composition. Further testing is suggested to determine the necessity for additional property requirements for laminate procurement specifications, such as minimum glass transition temperature and/or designation of resin composition. Glass-polyimide laminates should be considered for multilayer boards which must withstand extreme thermal cycling environments.

Authors:
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
OSTI Identifier:
7363348
Report Number(s):
SAND-76-0107
DOE Contract Number:  
AT(29-1)-789
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; PRINTED CIRCUITS; THERMAL CYCLING; EPOXIDES; GLASS; HIGH TEMPERATURE; MEDIUM TEMPERATURE; PAPER; ELECTRONIC CIRCUITS; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; 420800* - Engineering- Electronic Circuits & Devices- (-1989)

Citation Formats

Jennings, C W. Thermal cycle tests on double sided and multilayer printed wiring boards. United States: N. p., 1976. Web. doi:10.2172/7363348.
Jennings, C W. Thermal cycle tests on double sided and multilayer printed wiring boards. United States. https://doi.org/10.2172/7363348
Jennings, C W. 1976. "Thermal cycle tests on double sided and multilayer printed wiring boards". United States. https://doi.org/10.2172/7363348. https://www.osti.gov/servlets/purl/7363348.
@article{osti_7363348,
title = {Thermal cycle tests on double sided and multilayer printed wiring boards},
author = {Jennings, C W},
abstractNote = {Substantial differences were found in the capability of plated-through holes in both double sided and multilayer printed wiring boards to withstand thermal cycling between -65/sup 0/ and 125/sup 0/C. The circuit pattern used for the test contained 240 holes connected in series, 80 each of 0.51 mm, 0.76 mm and 1.02 mm dia. Double sided glass-epoxy and glass-polyimide boards withstood 544 cycles with a total circuit resistance increase of 2 percent. However, paper-epoxy boards revealed many open circuits and substantial electrical resistance increases for the same number of cycles. Considerable variation in electrical resistance increases in glass-epoxy multilayer boards was detected. Analysis of the behavior of the multilayer boards was clouded by the poor quality of the plated-through holes used. Current carrying capability provided a useful indication of hole degradation after cycling. A critical factor effecting plated-through hole reliability in thermal cycling environment appears to be laminate composition. Further testing is suggested to determine the necessity for additional property requirements for laminate procurement specifications, such as minimum glass transition temperature and/or designation of resin composition. Glass-polyimide laminates should be considered for multilayer boards which must withstand extreme thermal cycling environments.},
doi = {10.2172/7363348},
url = {https://www.osti.gov/biblio/7363348}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat May 01 00:00:00 EDT 1976},
month = {Sat May 01 00:00:00 EDT 1976}
}