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Arsenic implantation into polycrystalline silicon and diffusion to silicon substrate

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.323933· OSTI ID:7318343
Arsenic implantation into polycrystalline silicon and drive-in diffusion to silicon substrate have been investigated by MeV He/sup +/ backscattering analysis and also by electrical measurements. The range distributions of arsenic implanted into polycrystalline silicon are well fitted to Gaussian distributions over the energy range 60--350 keV. The measured values of R/sub P/ and ..delta..R/sub P/ are about 10 and 20% larger than the theoretical predictions, respectively. The effective diffusion coefficient of arsenic implanted into polycrystalline silicon is expressed as D=0.63 exp((-3.22 eV/kT)) and is independent of the arsenic concentration. The drive-in diffusion of arsenic from the implanted polycrystalline silicon layer into the silicon substrate is significantly affected by the diffusion atmosphere. In the N/sub 2/ atmosphere, a considerable amount of arsenic atoms diffuses outward to the ambient. The outdiffusion can be suppressed by encapsulation with Si/sub 3/N/sub 4/. In the oxidizing atmosphere, arsenic atoms are driven inward by growing SiO/sub 2/ due to the segregation between SiO/sub 2/ and polycrystalline silicon, and consequently the drive-in diffusion of arsenic is enhanced. At the interface between the polycrystalline silicon layer and the silicon substrate, arsenic atoms are likely to segregate at the polycrystalline silicon side.
Research Organization:
LSI Development Laboratory, Mitsubishi Electric Corporation, Minamishimizu, Amagasaki, Hyogo, 661, Japan
OSTI ID:
7318343
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 48:5; ISSN JAPIA
Country of Publication:
United States
Language:
English