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Double-layered encapsulant for annealing ion-implanted GaAs up to 1100 degreeC

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.89623· OSTI ID:7215683
A double-layered encapsulation consisting of a 1000-A plasma-deposited Si/sub 3/N/sub 4/ layer under a 3000-A CVD SiO/sub 2/ layer doped with arsenic has been used to anneal selenium ion-implanted GaAs at temperatures up to 1100 degreeC with no signs of mechanical failure when examined with a scanning electron microscope. Significant improvement in electrical activation of implanted layers over simple Si/sub 3/N/sub 4/ layer caps has also been observed at lower temperatures.
Research Organization:
Stanford University, Stanford, California 94305
OSTI ID:
7215683
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 31:3; ISSN APPLA
Country of Publication:
United States
Language:
English