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Effect of post-oxidation anneal temperature on radiation-induced charge trapping in metal-oxide-semiconductor devices

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.99828· OSTI ID:7142586
Polycrystalline silicon-gate metal-oxide-semiconductor (MOS) capacitors have been fabricated with high-temperature anneals from 800 to 950 /sup 0/C after gate oxidation and polycrystalline silicon deposition. Temperatures from 800 to 875 /sup 0/C are found to have very little effect on the radiation response of these devices. However, a rapid increase in radiation-induced oxide-trapped charge, ..delta..V/sub ot/, is observed for anneal temperatures above 875 /sup 0/C. This increase in ..delta..V/sub ot/ coincides with an experimentally observed change in the polycrystalline silicon grain structure. The anneal temperature was found to have a much smaller effect on radiation-induced interface-trap charge. The correlation of these results to other properties, e.g., stress, is discussed.
Research Organization:
Sandia National Laboratories, Albuquerque, New Mexico 87185
OSTI ID:
7142586
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 53:9; ISSN APPLA
Country of Publication:
United States
Language:
English