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Spatially varied activation of ion-implanted As during the regrowth of amorphous layers in Si

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.325225· OSTI ID:7095978
He backscattering technique and sheet-resistivity measurements show that the electrical activation of As implanted in (100) and (111) Si and annealed at relatively low temperatures (500--600 /sup 0/C) takes place from the vicinity of the crystalline substrate Si in the As profile. This is accompanied by the regrowth of the implantation-induced amorphous layer. The annealing temperature required for both the activation and the regrowth is dose dependent. No defect-induced diffusion of As has been observed in these annealing processes.
Research Organization:
Toshiba R and D Center, Tokyo Shibaura Electric Co., Ltd., 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki, Japan
OSTI ID:
7095978
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 49:6; ISSN JAPIA
Country of Publication:
United States
Language:
English

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