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Title: Plasma generating apparatus for large area plasma processing

Patent ·
OSTI ID:7083823

A plasma generating apparatus for plasma processing applications is based on a permanent magnet line-cusp plasma confinement chamber coupled to a compact single-coil microwave waveguide launcher. The device creates an electron cyclotron resonance (ECR) plasma in the launcher and a second ECR plasma is created in the line cusps due to a 0.0875 tesla magnetic field in that region. Additional special magnetic field configuring reduces the magnetic field at the substrate to below 0.001 tesla. The resulting plasma source is capable of producing large-area (20-cm diam), highly uniform (.+-.5%) ion beams with current densities above 5 mA/cm[sup 2]. The source has been used to etch photoresist on 5-inch diam silicon wafers with good uniformity. 3 figures.

DOE Contract Number:
AC05-84OR21400
Assignee:
Martin Marietta Energy Systems, Inc., Oak Ridge, TN (United States)
Patent Number(s):
US 5032202; A
Application Number:
PPN: US 7-416804
OSTI ID:
7083823
Resource Relation:
Patent File Date: 3 Oct 1989
Country of Publication:
United States
Language:
English