Cu/PI and Cu/PET adhesion: Influence of Si sup + ion mixing

Journal Article · Sun Mar 01 04:00:00 EST 1992 · Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States)

DOI:https://doi.org/10.1116/1.578060· OSTI ID:7069944

Galuska, A A ^[1]

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1. Sandia National Laboratories, Albuquerque, New Mexico 87185 (United States)

The adhesion and interfacial chemistry of 50 nm Cu films on poly({ital N},{ital N}- ({ital p},{ital p}{prime}-oxydiphenylene) pyromellitimide) (PI) and poly(ethylene terephthalate) (PET) substrates were examined as a function of {sup 28}Si{sup +} implantation through the interfaces. The implantation was performed with 70 keV {sup 28}Si{sup +} to doses between 1 and 10{times}10{sup 16} Si/cm{sup 2}, while the substrate temperature was kept between 50 and 80 {degree}C. The implantation induced extensive interfacial mixing and interfacial chemistry changes in both the Cu/PI and Cu/PET specimens. X-ray photoelectron spectroscopy analysis of the ion-induced Cu/PI interfacial chemistry indicated that the implanted {sup 28}Si{sup +} had reacted with both the film substrate species to form Cu--Si, Si--O, and Si--C bonding, which suggested the formation of interfacial complexes, such as Cu--Si--C and Cu--Si--O--C. Similar interfacial chemistry was produced in the Cu/PET specimens by the implantation. However, additional Cu 2{ital p}{sub 3/2} and O 1{ital s} peaks associated with Cu--O--Si bonding were observed, suggesting the formation of Cu--O--Si--C interfacial complexes. Despite these changes in interfacial chemistry, only small (factor of 2) changes in adhesion were observed upon scratch testing. The absence of larger adhesion increases was attributed to the rather weak bonding between Cu and Si.

• DOE Contract Number: AC04-76DP00789
• OSTI ID: 7069944
• Journal Information: Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States), Journal Name: Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States) Vol. 10:2; ISSN JVTAD; ISSN 0734-2101
• Country of Publication: United States
• Language: English

Related Subjects

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400201* -- Chemical & Physicochemical Properties
ADHESION
CHARGED PARTICLES
CHEMICAL BONDS
COPPER
ELEMENTS
ENERGY RANGE
ESTERS
FILMS
INTERFACES
IONS
KEV RANGE
KEV RANGE 10-100
METALS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
POLYESTERS
POLYMERS
SILICON IONS
THIN FILMS
TRANSITION ELEMENTS