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Semi-insulating InP grown at low temperature by metalorganic chemical vapor deposition

Journal Article · · Applied Physics Letters; (United States)
DOI:https://doi.org/10.1063/1.112374· OSTI ID:7028323
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  1. Center for Compound Semiconductor Microelectronics, Materials Research Laboratory, and Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (United States)
The growth of semi-insulating epitaxial InP layers at low substrate temperature (460 [degree]C) by low-pressure metalorganic chemical vapor deposition has been demonstrated using CCl[sub 4] as a dopant source. The resistivity of the material is a function of diluted CCl[sub 4] flow rate used during growth. For flow rates less than 5 sccm the material is [ital n] type, but for higher flows the resistivity of the material is approximately 5[times]10[sup 9] [Omega] cm. The semi-insulating behavior of the material is maintained after annealing at 600 [degree]C. Transmission electron microscopy does not reveal the presence of phosphorus precipitates in as-grown samples or in samples annealed at 400 and 600 [degree]C. There is significant carbon, hydrogen, and chlorine incorporation in the layers, as measured by secondary ion mass spectrometry. Room-temperature photoluminescence measurements suggest that nonradiative recombination is significant in the material and increases in samples grown with higher CCl[sub 4] flows.
DOE Contract Number:
FG02-91ER45439
OSTI ID:
7028323
Journal Information:
Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 65:3; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English