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Development of cosmic ray hardened power MOSFETs

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA)
OSTI ID:6948386
 [1]; ;  [2]
  1. Naval Weapons Support Center, Advanced Technology Div., Crane, IN (US)
  2. Harris Semiconductor, Mountaintop, PA (US)

Developmental power DMOS (double-diffused metal-oxide semiconductor) FETs (field effect transistors) were characterized in a simulated cosmic ray environment using heavy ions at the Brookhaven National Laboratory's tandem Van de Graaff accelerator facility. The primary failure mode encountered on FETS in this environment was susceptibility to single event burnout. Burnout of the power DMOS FET was catastrophic. Another failure mode was single event gate rupture. Although gate rupture is not as severe as burnout, its long-term effects are not known. Single event gate rupture causes performance degradation due to increased gate leakage current. An increase in current can pose serious problems to applications that cannot compensate for the added performance degradation. Long-term reliability of the gate oxide may be affected resulting in premature device failure. Each failure mode is discussed. Numerous processing lots were fabricated to experimentally verify that each failure mode could be successfully minimized. Test results show that an n-channel, 150-volt DMOS FET was fabricated that survived exposures to ions with LETs up to 80 MeV-cm{sup 2}/mg. Hardening approaches are discussed, including the advantages and disadvantages of each approach on the FETs performance.

OSTI ID:
6948386
Report Number(s):
CONF-890723--; CNN: N00164-86-C-0182
Journal Information:
IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA), Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA) Vol. 36:6; ISSN 0018-9499; ISSN IETNA
Country of Publication:
United States
Language:
English