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Characterization of reactively sputtered WN/sub x/ film as a gate metal for self-alignment GaAs metal--semiconductor field effect transistors

Journal Article · · J. Vac. Sci. Technol., B; (United States)
DOI:https://doi.org/10.1116/1.583463· OSTI ID:6909985

Properties of reactively sputtered WN/sub x/ films on a GaAs substrate have been investigated by electrical and physical analyses. WN/sub x/ films were deposited from a pure W target by using three types of sputtering systems: (1) Magnetron sputtering system equipped with RF and dc mode; (2) S-gun sputtering system; (3) RF diode sputtering system. The composition of WN/sub x/ films was easily and reproducibly controlled by changing the N/sub 2/ content in Ar--N/sub 2/ mixed ambient gas. The WN/sub x/--GaAs system was both electrically and metallurgically stable even after high-temperature annealing of up to 800/sup 0/C. The Schottky barrier height to n-type GaAs was more than 0.8 V, which is the highest value obtained so far among any other refractory metals. Self-aligned GaAs MESFET's were successfully fabricated using a WN/sub x/ gate. The transconductance was typically 150 mS/mm for 1.5 ..mu..m gate length.

Research Organization:
VLSI Research Center, Toshiba Corporation, 1, Komukai-Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan
OSTI ID:
6909985
Journal Information:
J. Vac. Sci. Technol., B; (United States), Journal Name: J. Vac. Sci. Technol., B; (United States) Vol. 4:6; ISSN JVTBD
Country of Publication:
United States
Language:
English

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