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U.S. Department of Energy
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Statistical process control for QML (Qualified Manufacturer's List) radiation hardness assurance

Conference ·
OSTI ID:6909224

Effective testing of highly-complex VLSI circuits employing ever decreasing feature sizes is becoming extremely difficult. This difficulty arises from the inability to routinely provide 100% fault coverage during testing of these complex functions, as well as by a scarcity of functional parts inherent in low-volume/high-product-mix military-component manufacturing lines. Under the sponsorship of RADC and DESC, the government has proposed a Qualified Manufacturer's List (QML) methodology to qualify ICs for high reliability and radiation hardness. In this approach, a production line is certified on a one-time'' basis, and all product from that line is subsequently qualified per the requirements of MIL-STD-38535. The approach places a large burden on the manufacturer or production source, who is tasked with demonstrating that the quality of the part is built in,'' as opposed to being tested in.'' This built-in'' quality is assured by the proper control of the IC manufacturing sequence from design through assembly. 13 refs., 5 figs.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
Sponsoring Organization:
DOE/DP
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6909224
Report Number(s):
SAND-90-0368C; CONF-900723--5; ON: DE90007413
Country of Publication:
United States
Language:
English

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