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Title: Implementing QML (Qualified Manufacturers List) for radiation hardness assurance

Conference ·
OSTI ID:6727928

Statistical process control (SPC) of technology parameters relevant to radiation hardness, test structure to Integrated Circuit (IC) correlation, and extrapolation from laboratory to threat scenarios are keys to implementing Qualified Manufacture's List (QML) for radiation hardness assurance in a cost-effective manner. Data from approximately 300 wafer lots fabricated in Sandia's 4/3-{mu}m and Complementry Metal Oxide Semiconductor (CMOS) IIIA (2-{mu}m) technologies are used to demonstrate approaches to, and highlight issues associated with, implementing QML for radiation-hardened CMOS in space applications. An approach is demonstrated to implement QML for signal-event upset SEU immunity on 16k SRAMs that involves relating values of feedback resistance to system error rates. It is seen that the process capability indices, C{sub p} and C{sub pk}, for the manufacture of 400 k{Omega} feedback resistors required to provide SEU tolerance do not conform to 6{sigma}'' quality standards. For total-dose, {triangle}V{sub it} shifts measured on transistors are correlated with circuit response in the space environment. SPC is illustrated for {triangle}V{sub it}, and violations of SPC rules are interpreted in terms of continuous improvement. Finally, design validation for SEU, and quality conformance inspections for total-dose, are identified as major obstacles to cost-effective QML implementation. Techniques and tools that will help QML provide real cost savings are identified as physical models, three-dimensional device-plus-circuit codes, and improved design simulators. 29 refs., 10 figs., 1 tab.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
Sponsoring Organization:
USDOD; DOE/DP
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6727928
Report Number(s):
SAND-90-1845C; CONF-900723-15; ON: DE90015697
Resource Relation:
Conference: 27. IEEE annual international nuclear and space radiation effects conference, Reno, NV (USA), 16-20 Jul 1990
Country of Publication:
United States
Language:
English

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