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Evolutionary phase diagrams for plasma-enhanced chemical vapor deposition of silicon thin films from hydrogen-diluted silane

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.124992· OSTI ID:689937
; ; ; ;  [1]
  1. Center for Thin Film Devices and Materials Research Laboratory, The Pennsylvania State University, University Park, Pennsylvania 16802 (United States)

Real-time optical studies have been applied to develop phase diagrams that characterize plasma-enhanced chemical vapor deposition (PECVD) of silicon thin films at low temperature (200&hthinsp;{degree}C). The deposition phase diagrams describe regimes over which predominantly amorphous and microcrystalline Si phases are obtained as a function of the accumulated thickness and the hydrogen-to-silane gas flow ratio R=[H{sub 2}]/[SiH{sub 4}] in the PECVD process. The diagrams for different substrates provide insights into optimization of amorphous Si materials and solar cells. {copyright} {ital 1999 American Institute of Physics.}

OSTI ID:
689937
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 15 Vol. 75; ISSN 0003-6951; ISSN APPLAB
Country of Publication:
United States
Language:
English

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