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Chemical vapor deposition of hydrogenated amorphous silicon from disilane

Journal Article · · Journal of the Electrochemical Society; (USA)
DOI:https://doi.org/10.1149/1.2096383· OSTI ID:5122810
; ;  [1]; ;  [2]
  1. Delaware Univ., Newark, DE (USA). Dept. of Chemical Engineering
  2. Delaware Univ., Newark, DE (USA). Inst. of Energy Conversion

The authors describe hydrogenated amorphous silicon (a-Si:H) thin films deposited at growth rates of 1 to 30 A/s by chemical vapor deposition (CVD) from disilane source gas at 24 torr total pressure in a tubular reactor. The effects of substrate temperature and gas holding time (flow rate) on film growth rate and effluent gas composition were measured at temperatures ranging from 360{sup 0} to 485{sup 0}C and gas holding times from 3 to 62s. Effluent gases determined by gas chromatography included silane, disilane and other higher order silanes. A chemical reaction engineering model, based on a silylene (SiH/sub 2/) insertion gas phase reaction network and film growth from both SiH/sub 2/ and high molecular weight silicon species, Si/sub n/H/sub 2n/, was developed. The model predictions were in good agreement with experimentally determined growth rates and effluent gas compositions.

OSTI ID:
5122810
Journal Information:
Journal of the Electrochemical Society; (USA), Journal Name: Journal of the Electrochemical Society; (USA) Vol. 136:10; ISSN 0013-4651; ISSN JESOA
Country of Publication:
United States
Language:
English