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Phase 2 of the array automated assembly task for the low cost silicon solar array project. Final report

Technical Report ·
DOI:https://doi.org/10.2172/6888950· OSTI ID:6888950
Studies were conducted on several fundamental aspects of electroless nickel/solder metallization for silicon solar cells. A process proposed by Motorola, which precedes the electroless nickel plating with several steps of palladium plating and heat treatment, was compared directly with single step electroless nickel plating. Work has directed toward answering specific questions concerning the effect of silicon surface oxide on nickel plating, effects of thermal stresses on the metallization, sintering of nickel plated on silicon, and effects of exposure to the plating solution on solar cell characteristics. The Motorola process was compared with simple electroless nickel plating in a series of parallel experiments. Results are presented. (WHK)
Research Organization:
Solarex Corp., Rockville, MD (USA)
DOE Contract Number:
NAS-7-100-954854
OSTI ID:
6888950
Report Number(s):
DOE/JPL/954854-80/8
Country of Publication:
United States
Language:
English