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U.S. Department of Energy
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Array automated assembly task for the Low-Cost Silicon Solar Array Project, Phase 2. Sixth quarterly report

Technical Report ·
DOI:https://doi.org/10.2172/5579272· OSTI ID:5579272
This program is concerned with nickel/solder metallization of silicon solar cells. Work in this second quarter of the program extension comprised portions of four experimental tasks. The task to study nickel plating on silicon oxide films has led to the finding that the plating solution dissolves oxide before depositing nickel. The electron microprobe study of nickel penetration of silicon has shown that sintering can be conducted for long times at 300/sup 0/C but that problems may arise above this temperature, even though there is no significant penetration of nickel into silicon below about 450/sup 0/C. Measurements on cells fabricated using plating times in the four to fourteen minute range indicate no degradation of cell properties as a result of contact with the plating solution in this time range, but do show evidence of poor contact quality if the nickel plate is either too thick or too thin. The task to assess the Motorola plating process is in its early stages, but it is evident that the process is a very complex and time consuming one.
Research Organization:
Solarex Corp., Rockville, MD (USA)
DOE Contract Number:
NAS-7-100-954854
OSTI ID:
5579272
Report Number(s):
DOE/JPL/954854-80/6
Country of Publication:
United States
Language:
English