Phase 2 of the array automated assembly task for the low cost silicon solar array project. Fifth quarterly report

Technical Report · Tue Jan 01 04:00:00 EST 1980

DOI:https://doi.org/10.2172/5430477· OSTI ID:5430477

Petersen, R C; Anderson, J R

This program focuses attention on one key step of a proposed process sequence for mass production of inexpensive silicon solar arrays for terrestrial use. The process step of concern is the metallization of the solar cell. Solarex has proposed that the metallization be accomplished by a single electroless plating of nickel followed by a dip in molten solder, and Solarex manufactures solar cells using this procedure. ing, cleaning and annealing. Motorola has recommended a process which includes the electroless nickel plate and solder dip of the Solarex process, but which precedes these steps with a number of additional steps of palladium plating, cleaning and annealing. Motorola has claimed that these additional steps are necessary to assure proper ohmic contact with the silicon while at the same time avoiding excessive nickel penetration into the silicon. This program comprises a technical comparison of the Solarex and Motorola processes. Progress is reported.

• Research Organization: Solarex Corp., Rockville, MD (USA)
• DOE Contract Number: NAS-7-100-954854
• OSTI ID: 5430477
• Report Number(s): DOE/JPL/954854-80/5
• Country of Publication: United States
• Language: English

Related Subjects

14 SOLAR ENERGY
140501* -- Solar Energy Conversion-- Photovoltaic Conversion
DEPOSITION
DIP COATING
DIRECT ENERGY CONVERTERS
ELECTRIC CONTACTS
ELECTRICAL EQUIPMENT
ELECTRICAL PROPERTIES
ELEMENTS
EQUIPMENT
FABRICATION
METALS
NICKEL
PHOTOELECTRIC CELLS
PHOTOVOLTAIC CELLS
PHYSICAL PROPERTIES
PLATING
PRODUCTION
SILICON SOLAR CELLS
SINTERING
SOLAR CELL ARRAYS
SOLAR CELLS
SOLAR EQUIPMENT
STRESSES
SURFACE COATING
THERMAL CYCLING
THERMAL SHOCK
TRANSITION ELEMENTS