Electronic materials and processes; Proceedings of the Third International SAMPE Electronics Conference, Los Angeles, CA, June 20-22, 1989

Conference · Sun Jan 01 04:00:00 EST 1989

OSTI ID:6877600

Lockerby, S C; Keyson, R; Saremi, F F; Visser, T

The preparation, properties, and applications of state-of-the-art electronics materials are discussed in reviews and reports. Sections are devoted to manufacturing technology, automatic inspection of solder joints, advanced resins, metal-matrix composites for electronics, low-dielectric polymers, circuit-board technology, thick films, microwave materials, conductive materials, EMI shielding, surface-mount technology, and ceramics. Consideration is given to the modeling and characterization of electronics packaging, high-Tc superconductor thin films, space effects on materials, photonics, excimer lasers for materials research, photoconductive polymers, polyimides, component failure analysis, alternatives to CFC cleaning, die attachment adhesives, multichip materials and processing techniques, contamination effects and removal, and thermally conductive adhesives.

• OSTI ID: 6877600
• Report Number(s): CONF-890664--
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360000 -- Materials
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ALLOYS
BONDING
COMPOSITE MATERIALS
COMPUTER-AIDED MANUFACTURING
DIELECTRIC MATERIALS
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
ELECTRONIC EQUIPMENT
EQUIPMENT
FABRICATION
FAILURES
FILMS
HIGH-TC SUPERCONDUCTORS
JOINING
JOINTS
MANUFACTURING
MATERIALS
MATERIALS TESTING
MEETINGS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PACKAGING
PETROCHEMICALS
PETROLEUM PRODUCTS
PHOTOCONDUCTIVITY
PHYSICAL PROPERTIES
PLASTICS
POLYMERS
RELIABILITY
RESINS
SOLDERED JOINTS
SUPERCONDUCTORS
SYNTHETIC MATERIALS
TESTING
THERMOPLASTICS
THIN FILMS