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Title: International SAMPE Electronics Conference, 5th, Los Angeles, CA, June 18-20, 1991, Proceedings

Conference ·
OSTI ID:6997215
; ;  [1]
  1. Hughes Aircraft Co., El Segundo, CA (United States)

The papers presented in this volume provide a comprehensive survey of recent research in ceramics, resins and polymers, adhesives and encapsulants, and composites, as well as new developments in failure analysis, testing, robotics, and assembly. Topics discussed include new piezoelectric ceramics for sonar transducer applications, conductive sealants and gaskets for EMI and EMP shielding with corrosion inhibition, noncuring fuel and water resistant sealant adhesives, and recent research on sensor and knowledge-based robotics. Papers are also presented on mechanical and electrical properties of laminates for high performance printed wiring boards, application of resin and metal matrix composites to advanced avionics enclosure, deposition techniques for thin-film solar cells, and detailed investigation of causes of avionics field failures.

OSTI ID:
6997215
Report Number(s):
CONF-910688-; ISBN: 0-938994-58-1
Resource Relation:
Conference: 5. international Society for the Advancement of Material and Process Engineering (SAMPE) electronics conference, Los Angeles, CA (United States), 18-20 Jun 1991
Country of Publication:
United States
Language:
English