Electronic materials - Our future; Proceedings of the 4th International SAMPE Electronic Materials and Processes Conference, Albuquerque, NM, June 12-14, 1990

Conference · Mon Jan 01 04:00:00 EST 1990

OSTI ID:5923826

Allred, R E; Martinez, R J; Wischmann, K B

The present conference on the advancement of electronic materials encompasses the processes and materials for EMI shielding, surface-mount technology, dielectric materials, radomes, electronic adhesives, superconductor materials, photonics and conductive polymers, packaging for severe environments, and rigid flex circuits. Specific issues addressed include radiation requirements for electronic components, silicon-carbide whisker-reinforced aluminum, antennae survivability, conductive epoxies, a thermal transfer adhesive for space electronics, macromolecular nonlinear optical materials, and photosensitive polyimidesiloxanes. Also addressed are issues such as the growth of tin whiskers, thick film resistors from low-TCR Pd-Ag alloys, process controls relating to solder cooling rates, stainless steel composites for ESD/EMI applications, thermoplastics static control, oxidation effects in PLZT ceramics, and flexible-circuit material evaluation.

• OSTI ID: 5923826
• Report Number(s): CONF-9006121--
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360000* -- Materials
42 ENGINEERING
426000 -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ABSTRACTS
ALLOYS
BONDING
CARBON FIBERS
CERAMICS
CHEMICAL REACTIONS
COMPOSITE MATERIALS
DOCUMENT TYPES
ELECTRONIC EQUIPMENT
ENVIRONMENT
EQUIPMENT
EXPANSION
FABRICATION
FIBERS
JOINING
LEAD ALLOYS
LEADING ABSTRACT
MATERIALS
MATERIALS TESTING
MECHANICAL PROPERTIES
MEETINGS
MICROELECTRONICS
NONLINEAR OPTICS
OPTICS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
OXIDATION
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
RADIATION EFFECTS
REINFORCED MATERIALS
RESINS
SILVER ALLOYS
STABILITY
SYNTHETIC MATERIALS
TESTING
THERMAL EXPANSION