Electronic materials and processes; Proceedings of the First International SAMPE Electronics Conference, Santa Clara, CA, June 23-25, 1987
Conference
·
OSTI ID:5367874
The present conference on the development status of electronic materials and manufacturing processes discusses topics in HV electronics materials, materials for mount technology, novel hermetic protection methods for circuits, novel microelectronic materials, electroactive materials, chemical sensors, polymers and adhesives for electronics applications, electronic ceramics, advanced semiconductors, low stress electronic adhesives and encapsulants, and novel encapsulant coatings. Attention is given to a liquid crystal polymer for surface-mounted components, UV coatings, platable silver metallizations, vapor-phase soldering, electrically conductive adhesives, GaAs wafer processing, semiconductor alloys, solderless contacts, pulsed UV curing, and printed wiring board laminates.
- OSTI ID:
- 5367874
- Report Number(s):
- CONF-870674-
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ABSTRACTS
ADHESIVES
BONDING
CONTROL
DOCUMENT TYPES
ELECTRICAL INSULATION
ELECTRONIC CIRCUITS
ELECTRONIC EQUIPMENT
EQUIPMENT
EXPANSION
FABRICATION
HEAT SINKS
INTEGRATED CIRCUITS
JOINING
LEADING ABSTRACT
MATERIALS
MEETINGS
MICROELECTRONIC CIRCUITS
MICROELECTRONICS
PRINTED CIRCUITS
SINKS
TEMPERATURE CONTROL
THERMAL EXPANSION
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ABSTRACTS
ADHESIVES
BONDING
CONTROL
DOCUMENT TYPES
ELECTRICAL INSULATION
ELECTRONIC CIRCUITS
ELECTRONIC EQUIPMENT
EQUIPMENT
EXPANSION
FABRICATION
HEAT SINKS
INTEGRATED CIRCUITS
JOINING
LEADING ABSTRACT
MATERIALS
MEETINGS
MICROELECTRONIC CIRCUITS
MICROELECTRONICS
PRINTED CIRCUITS
SINKS
TEMPERATURE CONTROL
THERMAL EXPANSION