Performance measurements of hybrid PIN diode arrays

Conference · Tue May 01 04:00:00 EDT 1990

OSTI ID:6857500

Jernigan, J G; Arens, J F ^[1]; Kramer, G ^[2]; Collins, T; Herring, J ^[3]; Shapiro, S L ^[4]; Wilburn, C D ^[5]

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1. California Univ., Berkeley, CA (USA). Space Sciences Lab.
2. Hughes Aircraft Co., El Segundo, CA (USA)
3. Hughes Aircraft Co., Carlsbad, CA (USA)
4. Stanford Linear Accelerator Center, Menlo Park, CA (USA)
5. Micron Semiconductor, Inc., Longwood, FL (USA)

We report on the successful effort to develop hybrid PIN diode arrays and to demonstrate their potential as components of vertex detectors. Hybrid pixel arrays have been fabricated by the Hughes Aircraft Co. by bump bonding readout chips developed by Hughes to an array of PIN diodes manufactured by Micron Semiconductor Inc. These hybrid pixel arrays were constructed in two configurations. One array format having 10 {times} 64 pixels, each 120 {mu}m square, and the other format having 256 {times} 256 pixels, each 30 {mu}m square. In both cases, the thickness of the PIN diode layer is 300 {mu}m. Measurements of detector performance show that excellent position resolution can be achieved by interpolation. By determining the centroid of the charge cloud which spreads charge into a number of neighboring pixels, a spatial resolution of a few microns has been attained. The noise has been measured to be about 300 electrons (rms) at room temperature, as expected from KTC and dark current considerations, yielding a signal-to-noise ratio of about 100 for minimum ionizing particles. 4 refs., 13 figs.

• Research Organization: Stanford Linear Accelerator Center, Menlo Park, CA (USA)
• Sponsoring Organization: DOE/ER
• DOE Contract Number: AC03-76SF00515
• OSTI ID: 6857500
• Report Number(s): SLAC-PUB-5211; CONF-900348--5; ON: DE90010308
• Country of Publication: United States
• Language: English

Related Subjects

43 PARTICLE ACCELERATORS
430303* -- Particle Accelerators-- Experimental Facilities & Equipment
CHARGED PARTICLE DETECTION
DATA ACQUISITION SYSTEMS
DESIGN
DETECTION
PERFORMANCE
RADIATION DETECTION
RESOLUTION
SEMICONDUCTOR DEVICES
SEMICONDUCTOR DIODES
SIGNAL-TO-NOISE RATIO
SPATIAL RESOLUTION
STORAGE RINGS
SUPERCONDUCTING SUPER COLLIDER