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Confined ion beam sputtering device and method

Patent ·
OSTI ID:6842848
A confined ion beam sputtering device is described comprising: a hollow cylindrical target having at least an inner wall surface of material selected for ion sputtering; a substrate supported within and electrically insulated from the cylindrical target; a first ion beam source means at one end of the cylindrical target for generating a first ion beam and directing the beam axially into the hollow cylindrical target toward the substrate; first biasing means for electrically biasing the substrate; and second biasing means for electrically biasing the cylindrical target independent of the first biasing means; whereby ions entering the cylindrical target may be electrically deflected circumferentially to impinge on the inner wall surface of the target at acute angles for efficiently sputtering material therefrom for deposit on the substrate.
Assignee:
Dept. of Energy, Washington, DC
Patent Number(s):
US 4747922
OSTI ID:
6842848
Country of Publication:
United States
Language:
English

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