Finite-element-method study of stresses on simulated electronic components encapsulated in polystyrene-bead foam

Technical Report · Sun Mar 01 04:00:00 EST 1981

DOI:https://doi.org/10.2172/6826705· OSTI ID:6826705

Swanson, G. D.

As part of an encapsulant evaluation for a high voltage electronic assembly, the linear elastic finite element method computer code SASL was used to calculate the stress distribution in an axisymmetric solder joint under load. A simulated electronic component in the form of a thumb tack was used as a physical model to calculate lead wire loads when encapsulated in 0.6 g/cm/sup 3/ polystyrene bead form. The calculated lead wire loads disagreed with previous experimental data. Reanalysis of those data revealed nonlinear effects which were not adequately modeled in the SASL calculation.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 6826705
• Report Number(s): BDX-613-2551
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
COLLOIDS
COMPUTER CODES
DISPERSIONS
ELECTRONIC EQUIPMENT
ENCAPSULATION
EQUIPMENT
FINITE ELEMENT METHOD
FOAMS
JOINTS
MATERIALS
NUMERICAL SOLUTION
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
S CODES
SOLDERED JOINTS
STRESS ANALYSIS
SYNTHETIC MATERIALS