Thumb tack physical model evaluation of polystyrene bead foam as an encapsulant for electronic packages

Technical Report · Sat Mar 01 04:00:00 EST 1980

DOI:https://doi.org/10.2172/5641281· OSTI ID:5641281

Fossey, D. J.; Swanson, G. D.

A physical model in the shape of a thumb tack is used to measure forces on electronic component lead wires when soldered into printed wiring boards. Encapsulation of electronic packages in polystyrene bead foam of 0.2, 0.3, 0.4, 0.5, and 0.6 g/cm/sup 3/ densities was evaluated. No solder joint damage was seen. Crushing pressures on metal transistors also were safe for all densities. Experimental data agreed well with theoretical calculations based on the concept of constrained thermal expansion.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 5641281
• Report Number(s): BDX-613-2416
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ALKANES
COLLOIDS
DAMAGE
DATA
DATA FORMS
DENSITY
DISPERSIONS
ELECTRONIC CIRCUITS
ENCAPSULATION
EVALUATION
EXPANSION
EXPERIMENTAL DATA
FOAMS
GRAPHS
HYDROCARBONS
INFORMATION
JOINTS
NUMERICAL DATA
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PENTANE
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
PRESSURE DEPENDENCE
PRINTED CIRCUITS
SAFETY
SEMICONDUCTOR DEVICES
SIMULATION
SOLDERED JOINTS
TABLES
TEMPERATURE DEPENDENCE
THERMAL CYCLING
THERMAL EXPANSION
TRANSISTORS