Multi-transducer dummy unit evaluation of polystyrene bead foam as an encapsulant for electronic packages

Technical Report · Mon Sep 01 04:00:00 EDT 1980

DOI:https://doi.org/10.2172/5010882· OSTI ID:5010882

Swanson, G. D.

A dummy electronic assembly without electronic components was used to measure loadings and deflections caused by 0.2, 0.3, 0.4, 0.5 and 0.6 g/cm/sup 3/ densities of polystyrene bead foam during fusion and thermal cycling. Previously developed and proven transducers showed that the lower three densities caused low and safe loads and deflections, but that the highest two densities must be used with care for fragile electronic components.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5010882
• Report Number(s): BDX-613-2488
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
DATA
DEFORMATION
DENSITY
ELECTRONIC EQUIPMENT
ENCAPSULATION
EQUIPMENT
EXPERIMENTAL DATA
INFORMATION
MATERIALS TESTING
NUMERICAL DATA
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PACKAGING
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
SAFETY
TESTING