Properties of polystrene bead foam as an encapsulant for electronic packages. Final report
Polystyrene bead foam (PSBF) was evaluated as an encapsulant for electronic packages. Various properties of PSBF pertinent to the expected environmental conditioning of a prototype electronic package were determined and evaluated for their effects on individual electronic components, within the package. It was determined that PSBF densities of 0.2 to 0.4 g/cm/sup 3/ provided adequate protection without damaging fragile electronic components. PSBF densities above 0.4 g/cm/sup 3/ provide adequate protection from the shock and vibration spectra evaluated, but could damage fragile electronic components during the encapsulation process and thermal cycling. Buildup of electrostatic voltage during encapsulation can be reduced to safe levels by grounding the case of the electronic package. Only the 0.6 g/cm/sup 3/ PSBF could be made impervious to moisture penetration.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6589652
- Report Number(s):
- BDX-613-2618
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
420200* -- Engineering-- Facilities
Equipment
& Techniques
CONFIGURATION
CONTAINERS
ELECTRONIC EQUIPMENT
EQUIPMENT
MATERIALS
MECHANICAL PROPERTIES
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PACKAGING
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
SHOCK WAVES
SPHERICAL CONFIGURATION
SYNTHETIC MATERIALS