Determination of fusion cycles for polystyrene bead foam. Final report

Technical Report · Tue Jun 01 00:00:00 EDT 1982

OSTI ID:5197267

Fossey, D J

The fusion cycles required to encapsulate two electronic packages with 0.3 g/cm/sup 3/ polystyrene bead foam (PSBF) were developed. The encapsulation process for one unit included the uniform dispersion of desiccant beads in the PSBF. An epoxy coating was required to maintain the integrity of the PSBF surfaces in the cavity formed for a block of molded desiccant. A method to obtain adhesion of the PSBF to an aluminum substrate was developed.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 5197267
• Report Number(s): BDX-613-2782; ON: DE82016357
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360401* -- Polymers & Plastics-- Preparation & Fabrication-- (-1987)
42 ENGINEERING
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
ELECTRONIC CIRCUITS
ENCAPSULATION
FABRICATION
MATERIALS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PLASTICS
POLYMERS
POLYOLEFINS
POLYSTYRENE
POLYVINYLS
SYNTHETIC MATERIALS